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Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a significant manner. Thanks to recent advances in 3D integration, wafer-level packaging and MEMS, novel types of components with small form factors and an increased number of functionalities are emerging. These novel components also require new packaging solutions. To support the growing interest in these activities, we are looking for an R&D Engineer for Wafer Grinding.
Wafer grinding is a device fabrication step during which the wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC’s).
You will be a member of the Chemical Mechanical Planarization (CMP) team at imec, that is responsible for developing processes requested by the process integration departments running imec’s CORE and CMORE programs. The CMP team currently consists of ~12 people with whom you will interact on a daily basis. You will work in a dynamic multidisciplinary environment in close cooperation with researchers, scientists, hardware engineers, device and process experts, equipment vendors, industrial assignees and operators.
As a specialist in your field, you will be responsible for developing, optimizing, maintaining and documenting high-end grinding processes on state-of-the-art equipment.
More specifically, your tasks include:
You will be coached on-the-job by senior colleagues and the CMP team leader.
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process, not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a competitive salary with many fringe benefits.
Intitulé | R&D Engineer Grinding |
Employeur | imec |
Job location | Kapeldreef 75, B-3001 Heverlee |
Publié | mars 2, 2021 |
Date limite d'inscription | Non Spécifiée |
Types d'emploi | Ingénieur Chercheur   |
Domaines de recherche : | Génie des matériaux,   Chimie des matériaux,   Génie industriel,   Physique des matériaux,   Électronique   |