
il y a 6 heures
| Se termine le juin 30
Post Doctoral position : DEIMOS beamline
SOLEIL is the French national synchrotron facility, located on the Saclay Plateau near Paris. It is a multi-disciplinary instrument and a research laboratory, whose mission is to run research programs using synchrotron radiation, to develop state-of-the-art instrumentation on...

il y a 9 heures
| Se termine le mars 28
Doctoral Researcher (chemistry), 1-2 positions
Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edges in technology, health and society. Read...

il y a 13 heures
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...

il y a 1 jour
| Se termine le juin 15
Call for Dioscuri Centres of Scientific Excellence in Poland
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland.
The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...

il y a 1 jour
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...

il y a 2 jours
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...

il y a 2 jours
R&D Engineer Layer Transfer
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system...