
il y a 3 jours
Vice Provost, Academic Affairs
Vice Provost Office
Location
Vietnam
Open Date
Feb 5, 2021
Description
ABOUT VINUNIVERSITY
VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...

il y a 3 jours
Vice Provost, Research & Innovation
Vice Provost Office
Location
Vietnam
Open Date
Feb 5, 2021
Description
ABOUT VINUNIVERSITY
VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...

il y a 3 jours
Dean of Engineering & Computer Science
College of Engineering and Computer Science
Location
Vietnam
Open Date
Feb 5, 2021
Description
ABOUT VINUNIVERSITY
VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international...

il y a 4 jours
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...

il y a 4 jours
| Se termine le juin 15
Call for Dioscuri Centres of Scientific Excellence in Poland
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland.
The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...

il y a 5 jours
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...

il y a 5 jours
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...