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157 Offres en Génie des matériaux

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RÉSULTATS (157 EMPLOIS)
il y a 3 jours
Vin University
Vin University
Localisation: Hanoi, Vietnam
Vice Provost, Academic Affairs
Vice Provost Office Location Vietnam Open Date Feb 5, 2021 Description ABOUT VINUNIVERSITY VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...
il y a 3 jours
Vin University
Vin University
Localisation: Hanoi, Vietnam
Vice Provost, Research & Innovation
Vice Provost Office Location Vietnam Open Date Feb 5, 2021 Description ABOUT VINUNIVERSITY VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...
il y a 3 jours
Vin University
Vin University
Localisation: Hanoi, Vietnam
Dean of Engineering & Computer Science
College of Engineering and Computer Science Location Vietnam Open Date Feb 5, 2021 Description ABOUT VINUNIVERSITY VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international...
il y a 4 jours
Advanced Research Center for Nanolithography ARCNL
Advanced Research Center for Nanolithography ARCNL
Localisation: Amsterdam, Pays-Bas
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...
il y a 4 jours | Se termine le oct. 31
CEA Tech
CEA Tech
Localisation: Grenoble, France | Se termine le oct. 31
PhD - Nouvelles topologies de circuits intégrés exploitant des composants capacitifs innovants sur silicium
SL-DRT-21-0814 DOMAINE DE RECHERCHE Matériaux et procédés émergents pour les nanotechnologies et la microélectronique RÉSUMÉ DU SUJET L’objectif de cette thèse est de d’évaluer l’intérêt des capacités hybrides sur silicium développées au LETI...
il y a 4 jours | Se termine le oct. 31
CEA Tech
CEA Tech
Localisation: Grenoble, France | Se termine le oct. 31
PhD position - novel integrated circuit topologies using innovative capacitive components on silicon
SL-DRT-21-0814 RESEARCH FIELD Emerging materials and processes for nanotechnologies and microelectronics ABSTRACT The objective of this thesis is to assess the potentiel of hybrid silicon capacitors developed at LETI as components in novel architectures of...
il y a 4 jours | Se termine le juin 15
Max-Planck-Gesellschaft (MPG) & National Science Centre Poland (NCN)
Max-Planck-Gesellschaft (MPG) & National Science Centre Poland (NCN)
Localisation: Pologne | Se termine le juin 15
Call for Dioscuri Centres of Scientific Excellence in Poland
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland. The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...
il y a 5 jours
AMOLF
AMOLF
Localisation: Amsterdam, Pays-Bas
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...
il y a 5 jours | Se termine le avr. 15
Université catholique de Louvain
Université catholique de Louvain
Localisation: Louvain-La-Neuve, Belgique | Se termine le avr. 15
Postdoctoral position – Fabrication of a patch for diabetes treatment by 3D bioprinting
A postdoctoral position in ‘Development of a patch by 3D bioprinting for diabetes treatment’ starting in April 2021 (negotiable) is open in the Institute of Condensed Matter and Nanosciences in close collaboration with the Laboratory of Experimental Surgery (Prof. Pierre...
il y a 5 jours
imec
imec
Localisation: Heverlee, Belgique
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...