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119 Offres en Physique des matériaux

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RÉSULTATS (119 EMPLOIS)
Sponsorisé
Université de Namur
Université de Namur
Localisation: Namur, Belgique | Se termine le mars 31
Chargé de cours en Didactique de la Physique (H/F) à mi-temps pour la Faculté des Sciences
Faculté : Faculté des sciences Département : Département de Physique Date d'entrée en fonction : 1/9/2021 Grade : chargé de cours Contrat : durée indéterminée avec période d'intégration - Le Conseil d’administration prévoit, sauf exception motivée,...
il y a 8 heures | Se termine le juin 30
SOLEIL Synchrotron
SOLEIL Synchrotron
Localisation: Saint-Aubin, France | Se termine le juin 30
Post Doctoral position : DEIMOS beamline
SOLEIL is the French national synchrotron facility, located on the Saclay Plateau near Paris. It is a multi-disciplinary instrument and a research laboratory, whose mission is to run research programs using synchrotron radiation, to develop state-of-the-art instrumentation on...
il y a 10 heures | Se termine le mars 28
Tampere University
Tampere University
Localisation: Tampere, Finlande | Se termine le mars 28
Doctoral Researcher (chemistry), 1-2 positions
Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edges in technology, health and society. Read...
il y a 1 jour | Se termine le juin 15
Max-Planck-Gesellschaft (MPG) & National Science Centre Poland (NCN)
Max-Planck-Gesellschaft (MPG) & National Science Centre Poland (NCN)
Localisation: Pologne | Se termine le juin 15
Call for Dioscuri Centres of Scientific Excellence in Poland
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland. The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...
il y a 1 jour
AMOLF
AMOLF
Localisation: Amsterdam, Pays-Bas
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...
il y a 2 jours
imec
imec
Localisation: Heverlee, Belgique
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...
il y a 2 jours
imec
imec
Localisation: Heverlee, Belgique
R&D Engineer Layer Transfer
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices). What you will do Miniaturization of system...
il y a 2 jours
imec
imec
Localisation: Heverlee, Belgique
R&D Engineer Die to Wafer bonding
You will be responsible for developing new die bonding processes and will particicpate in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices). What you will do Miniaturization of system size is a...
il y a 2 jours
imec
imec
Localisation: Heverlee, Belgique
R&D engineer Wafer to Wafer bonding
You will be responsible for developing new wafer bonding processes and participate in research activities where wafer to wafer bonding is required (3D logic, 3D integrated systems, image sensors, biomedical devices). What you will do Miniaturization of system size is a...
il y a 2 jours
imec
imec
Localisation: Heverlee, Belgique
R&D Engineer Temporary Wafer Bonding & Debonding
You will be responsible for developing new temporary wafer bonding and debonding processes and you participate in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices). What you will...